Near-Packaged Optics

Materials, devices, and modules on one structural map

In the OIF co-packaging framework, near-package optics has a specific meaning: a packaged ASIC and an engine, socketed to a common substrate so they can be attached and removed for assembly and rework. NPOTEC organizes three planned layers around that boundary: raw materials, devices, and modules.

The drawing below separates mounting positions only. It is not a photograph, and it is not a bill of materials shared by every design.

01

Pluggable

ASICSwitch or compute ASIC
Chip-to-module electrical path
Front-panel modulePluggable transceiver
02

Near-package

Common substrate
Packaged ASICDie + substrate / RDL
EngineAttachable
03

Co-packaged

Same first-level substrate
ASICHost ASIC
Engine
Engine
A concept sketch from the wording of OIF-Co-Packaging-FD-01.0. It is not to scale, and it is not an NPOTEC assembly drawing.

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How to read the classes

  1. 01

    Start with mounting position. A front-panel pluggable, socketed near-package optics, and co-packaging on the same first-level substrate are three different drawings.

  2. 02

    Then look at the options. The laser may be inside or outside the engine, and the framework sketches at least four electrical styles: retimed, linear, half-retimed, and direct drive.

  3. 03

    Only then match materials. Columns on the materials page drop out depending on the first two choices. The page is not one purchase.

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