筹备中 · In preparation规划方向 · Planned scope
The NPOTEC catalog itself
The category structure is being organized. This step has no date, and it does not correspond to a lot of material, a tape-out, or a production line.
Order in the literature
The path follows documents, not a supply calendar
This page places published interfaces and the framework in date order, so it is clear when, and in which sentence, the near-package name was used. NPOTEC’s own catalog is still in preparation. There is no quarterly commitment below.
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Chip-to-module is given its own project
The OIF CEI-112 fact sheet dates the Very Short Reach project to August 2016 and describes it as a chip-to-module electrical interface for optical modules. The electrical path of a pluggable module belongs to this class. It is not the definition of near-package optics.
Sources OIF hot-topic fact sheet: Common Electrical I/O (CEI)-112
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An extra-short-reach project for inside the package
The 12 June 2018 announcement started CEI-112G-XSR for die-to-die and die-to-optical-engine links, with a reach target up to 50 mm, and discussed CMOS and SiGe on an organic package substrate. The fact sheet dates the project start to April 2018. This is an in-package electrical project, not the definition of the word NPO.
Sources OIF press release: CEI-112G-XSR project for D2D/D2OEOIF hot-topic fact sheet: Common Electrical I/O (CEI)-112
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On-board optics receives its own specification
COBO Release 1.1 defines optical modules on the circuit board. It sits near pluggables, near-package optics, and co-packaging, with a different mounting place and a different document.
Sources COBO 8-Lane & 16-Lane On-Board Optics Specification, Release 1.1
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The framework writes down near-package optics
The cover date of OIF-Co-Packaging-FD-01.0 is 3 February 2022. It defines co-packaging as the same first-level substrate as the host ASIC, and it calls the socketed, removable arrangement near-package optics. Later it uses a 1RU, 51.2 Tb/s Ethernet switch as the main example while describing co-packaging. That is the document’s example.
Sources OIF-Co-Packaging-FD-01.0, Co-Packaging Framework Document
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Management of an external source is written down
The management white paper recommends that the host board controller decide how continuous-wave light is assigned. Modules stay simple, and the implementer decides the wiring. That is another way of saying there is no shared bill of materials.
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XSR+ names near-package optics as one application
The public summary of CEI-112G-XSR+-PAM4 lists multichip modules, co-packaged optics, and near-package optics together as intended applications, and it states the 112 Gb/s PAM4 loss class up to 13 dB. It extends an electrical interface. It is not one company’s product roadmap.
Sources OIF press release: CEI-112G-XSR+-PAM4 Extended Extra Short Reach
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The external-laser form factor is revised
The cover date of OIF-ELSFP-02.0 is 8 January 2025. It remains a replaceable continuous-wave module for systems that choose an external laser, aimed primarily at co-packaging. A near-package design that integrates the laser does not require this module.
Sources OIF-ELSFP-02.0, External Laser Small Form Factor Pluggable Implementation Agreement