Read on 11 November 2026
Technical sentences point back to a public document
Structural claims and figures in the pages use only what can be read directly in the texts below. Vendor blogs and market estimates are not in the body copy.
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OIF-Co-Packaging-FD-01.0, Co-Packaging Framework Document
Defines co-packaging, names socketed near-package optics (Figure 2d), and discusses lasers, fiber exit, solder versus socket, and electrical-interface sketches.
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OIF press release: CEI-112G-XSR+-PAM4 Extended Extra Short Reach
Public summary of the published IA: 112 Gb/s PAM4, bump-to-bump loss up to 13 dB at Nyquist, 36–58 Gsym/s, intended for MCM, CPO, and NPO assemblies.
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OIF press release: CEI-112G-XSR project for D2D/D2OE
Project launch note: intra-package die-to-die and die-to-optical-engine links, 72–116 Gbps, a reach target up to 50 mm, and a CMOS-to-SiGe mix on a common organic package substrate.
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OIF hot-topic fact sheet: Common Electrical I/O (CEI)-112
Describes Very Short Reach as a chip-to-module interface, XSR as a die-to-die / die-to-optical-engine project up to 50 mm, and MCM up to 25 mm. These are project descriptions, not a definition of NPO.
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OIF-ELSFP-02.0, External Laser Small Form Factor Pluggable Implementation Agreement
Form-factor agreement for a faceplate-pluggable external CW laser, aimed primarily at co-packaged systems whose optical engines do not integrate the laser. It compares laser thermal limits with silicon photonic circuits and germanium photodetectors.
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OIF-MGT-Co-Packaging-ELSFP-01.0, Management of External Light Sources and Co-Packaged Optical Engines
Recommends that the host board controller, not the optical module, hold the intelligence for CW light. Its examples: a 3.2 Tb/s optical engine may have 4 or 8 CW inputs, and an ELSFP has up to 16 CW outputs. The mapping is chosen by the implementer.
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OIF Energy Efficient Interfaces interoperability demo notes, ECOC 2024
While explaining ELSFP, lists co-packaged and near-packaged systems in one industry-need bullet, and says an ELSFP supplies CW light to optical engines, one source feeding more than one engine. A 3.2T module example on the deck separates optics (laser, modulator, photodetector) from the electrical IC (driver, TIA, control).
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COBO 8-Lane & 16-Lane On-Board Optics Specification, Release 1.1
Defines 8-lane and 16-lane optical modules mounted on the board, for up to 1×400G and 2×400G, pigtailed or connectorized. The specification says the optical physical layer is out of scope. This is not the socketed near-package arrangement in the OIF framework.