A planned product family

NPO ELSFP

ELSFP is a faceplate-pluggable form factor published by OIF. It delivers continuous-wave light to systems whose optical engines do not integrate the laser, and it is field-replaceable. The agreement says it is aimed primarily at co-packaged optics. Public demonstration notes also name near-packaged systems in the same need statement.

Only a design that places the laser outside the engine needs this module. NPOTEC includes ELSFP in its planned full stack. This page remains planned scope, not a finished or orderable part. The image is a conceptual product image.

Conceptual product image: an ELSFP form with a finned aluminum body and a blue pull-tab. A campaign still life, not a photograph of a shipping product. Conceptual product image
A conceptual product image for brand presentation, not a photograph of a shipping product.
筹备中 · In preparation规划方向 · Planned scope

External light-source module

ELSFP is a faceplate-pluggable form factor that delivers continuous-wave light to systems whose optical engines do not integrate the laser, and it is field-replaceable. The agreement says it is aimed primarily at co-packaged optics, including switches, network interface cards, and ASICs used for artificial intelligence and machine learning. The ECOC 2024 deck names co-packaged and near-packaged systems in the same need statement.

What changes between designs Only a design that places the laser outside the engine needs this module. An integrated laser does not take this path. One source can feed more than one engine, and one engine can have several continuous-wave inputs. In the OIF management white paper, the control intelligence sits in the host board controller, not inside the module.

Sources OIF-ELSFP-02.0, External Laser Small Form Factor Pluggable Implementation AgreementOIF Energy Efficient Interfaces interoperability demo notes, ECOC 2024OIF-MGT-Co-Packaging-ELSFP-01.0, Management of External Light Sources and Co-Packaged Optical Engines

筹备中 · In preparation规划方向 · Planned scope

Lasers and continuous-wave sources

The framework says the source may be several lasers at several wavelengths, for FR-class applications, or one or more lasers at one wavelength, for DR, VR, and SR-class applications. In a silicon photonic engine the lasers may sit inside the engine or outside it, with continuous-wave light used together with modulators.

What changes between designs An external laser takes extra insertion loss and may need higher optical power to compensate; an integrated laser has fewer losses to overcome. That is a tradeoff in the document, not a fixed recipe. VCSEL plus multimode fiber is described as a possible lower-power option for short reach, not as the default.

Sources OIF-Co-Packaging-FD-01.0, Co-Packaging Framework Document