Pluggable
ASICSwitch or compute ASIC
Chip-to-module electrical path
Front-panel modulePluggable transceiver
Planned scope
The rest of the stack
Beyond the four product families, public documents also arrange material roles and device functions: semiconductors and sources, substrates, thermal-mechanical parts, modulation and detection, and electrical interfaces. They belong to the same plan as modules, sockets, ELSFP, and pigtails. They are not a second list to be purchased together.
Near-package
Common substrate
Packaged ASICDie + substrate / RDL
EngineAttachable
Co-packaged
Same first-level substrate
ASICHost ASIC
Engine
Engine
筹备中 · In preparation规划方向 · Planned scope
Raw materials
Silicon photonics and germanium detection, laser materials, substrates and sockets, fiber, and thermal-mechanical retention. Each is a place in the literature, not a stock line.
Sources OIF-Co-Packaging-FD-01.0, Co-Packaging Framework Document
筹备中 · In preparation规划方向 · Planned scope
Devices
Modulation and detection, light sources, electrical interfaces, and fiber coupling. There are at least four electrical sketches and three source paths.
Sources OIF-Co-Packaging-FD-01.0, Co-Packaging Framework Document
How to read the classes
- 01
Start with mounting position. A front-panel pluggable, socketed near-package optics, and co-packaging on the same first-level substrate are three different drawings.
- 02
Then look at the options. The laser may be inside or outside the engine, and the framework sketches at least four electrical styles: retimed, linear, half-retimed, and direct drive.
- 03
Only then match materials. Columns on the materials page drop out depending on the first two choices. The page is not one purchase.